All Products

Carbon-ceramic composite mold for 3D glass hot forming that withstands 750°C+ (enabling glass-ceramic forming) and delivers over 50x the service life of graphite molds, supporting 3D double-curved and large-curvature shapes.

Carbon-ceramic diffusion-bonding mold that replaces graphite tooling for solid-state Cu-Al diffusion bonding and Cu-Al vacuum brazing of soft busbars (laminated busbars, flexible connectors, nickel/aluminum transition strips) — heat- and pressure-tolerant, dimensionally stable and non-shedding

Carbon-ceramic high-temperature carrying fixtures/trays replacing graphite and metal tooling for sintering, heat treatment and other high-temperature processes.

Dedicated particle-removal pre-cleaner for FOUP/FOSB carriers; spray-suitable neutral formulation with foaming controlled for automated cleaning.

Strong removal of organic residues (adhesives, oils, organic soils) from FOUPs; mild-alkaline formulation validated for solubility-parameter-matched penetration.

Formulated for high-temperature FOUPs (PEI); withstands 120°C+ processes with elevated cleaning power at high operating temperatures.

Strong-alkaline cleaning of PFA cassettes with outstanding compatibility with fluoropolymer materials.

Anti-haze cleaning for reticle/mask pods with tightly controlled ionic residues.

One-step removal of blue/UV tape adhesive residue after wafer dicing, balancing stripping power with wafer/chip safety.

Removes particles and metallic residues after CMP; technology extension of the SP-Clear series.

Efficient removal of polymer residues after dry etch and ashing; water-based with high closed-cup flash point for safe operation at 70°C.

Removes edge bead residue after lithography; electronic-grade purity for yield protection.

Low-foam mild-alkaline cleaner removing residual plating solution and particles after bump plating.

Removes adhesive residue left after temporary bonding/de-bonding; water-based with a closed-cup flash point above 60°C for safe heated operation.

Removes particles and metallic residues after back-grinding/thinning; improved SC1-type formulation.

Cleans inside high-aspect-ratio through-glass vias; surface tension below 30 mN/m lets the bath penetrate straight to the via bottom.

Post-etch surface and post-CMP cleaning compatible with fluorine-containing etch residues on TGV glass substrates.

Selective etching of Cu/Ti seed layers for TGV/RDL patterning with endpoint control and near-zero attack on the glass substrate.

Complete UBM seed-layer etch kit — separate copper and titanium etchants for stepwise processing; near-zero glass loss.

Modifies glass before TGV seed-layer deposition to multiply copper adhesion; 5B tape-peel rating and 240 h 85°C/85%RH reliability demonstrated.

High-purity Ti etching for 1 µm fine lines with side etch below 0.3 µm; excellent selectivity to glass, SiO₂ and photoresist.

Etchant for next-generation Mo interconnect metal, positioning for future process nodes; classic PAN chemistry plus an Al-compatible option.

Etchant for ruthenium, a candidate next-generation interconnect metal; formulation significantly suppresses escape of highly toxic volatile byproducts.

W/TiW etching for advanced packaging metallization; cyanide-free alkaline chemistry with stable supply chain.

Packaging-grade standard developer system for RDL processes; electronic-grade purity with no metal ions (MIF).

Through-glass-via etch by femtosecond-laser modification plus hot-alkali etching; >50:1 selectivity with near-zero etch of bulk glass and no toxic fluorine acids.

Strips RDL/semiconductor photoresist by migrating proven ACF-debonding chemistry; copper loss below 0.05 µm/h at 70°C.

Cold-soak removal of ACF adhesive residue without attacking ITO; works at room temperature with no heating equipment.

Precision cleaning before IC/display bonding; halogen-free, phosphorus-free, nitrogen-free and flash-point-free, designed to a no-residue standard.

Removes OCA/LOCA adhesive residue during screen disassembly and rework without damaging the polarizer.

Chemical stripping of polarizers during display-module disassembly/recycling; alkali bath separates polarizer from glass while protecting the glass substrate.

Rework debonding of UV-cured adhesives for optical and circuit-board parts; compliant alternative free of carcinogenic halogenated solvents.

Color-filter development benchmarked against Nippon Kayaku; fills a near-empty domestic gap for color-filter lines.

Process cleaning for color-filter lines; safe to ITO, phosphorus-free and APEO-free with a low-foam design.

Substrate cleaning before polyimide coating; respects the PI red line — no hydrolysis or swelling damage to cured alignment layers.

Cleaning for the liquid-crystal stage of panel processes; a three-no standard keeps the LC cell safe.

Pattern etching of ITO for panels and touch; organic-acid route with excellent selectivity to glass, photoresist and black matrix.

Etches Mo/Al wiring in copper-process TFT-LCD lines for 4K2K panels; blended-acid mainstream route balancing etch rate and line profile.

Safety companion for glass thinning lines — pre-thinning pretreatment and post-thinning cleaning on a fluorine-free route.

Process cleaning for 3D curved glass.

General-purpose cleaning across glass manufacturing processes.

Eco-friendly glass cleaning.

Eco-friendly glass cleaning with fast drying and fewer water marks.

General-purpose alkaline cleaning for glass substrates.

Oxidative-decomposition cleaning for glass.

Multi-component general-purpose cleaning for glass process lines.

Pre-bending degreasing plus coolant-residue cleaning in one product.

Drop-in domestic alternative to Deconex OP164 for precision glass cleaning.

Neutral cleaning for panel AOI inspection steps.

Companion additive for the OP164 cleaning system.

Dedicated stripper for TOYO-series inks combining strong alkali with penetrating peel-off chemistry.

Mature alkaline ink-stripping solution that adapts directly to production-line processes.

General-purpose screen-printing ink stripper.

One bath strips both ink and coatings on optical glass — a dual-function solution covering two rework cases.

Customer-process-tuned, high-solvent stripper targeting stubborn screen-printing inks.

Combined adhesive-debonding and ink-stripping solution — one product for two rework jobs.

Dedicated rework stripper for cover glass; stable alkali-plus-penetrating-solvent ink removal.

Mass-production stripper for TOYO BL-7M056 ink; strong-alkali plus penetrating peel-off system; 1,581 units passed full production validation.

Stripper for PVD coatings on glass.

Stripper for coated glass parts using a blended acid-etch system.

Project-customized stripper for niobium pentoxide (Nb₂O₅) coatings on optical coated glass.

Strong-acid corrosive system with high stripping power.

Removes nickel coatings from glass without damaging the glass or the ink — mild acid-etch system.

Specialized adhesive debonding for fingerprint modules using an alkaline plus penetrating-solvent swelling system.

High-concentration display lamination adhesive remover (final version) that strips adhesive without damaging the AF coating.

Lamination-adhesive remover that protects the AF coating throughout the debonding process.

Simplified lamination-adhesive remover that keeps the core AF-safe capability with a leaner system.

Adhesive remover for display lamination debonding.

Low-foam cleaner built for spray cleaning lines.

Low-foaming cleaner for washing/spray lines.

Simplified low-foam cleaner.

Ceramic-based high-temperature release coating for glass hot bending; withstands 850°C+ in oxidizing atmospheres (900–1250°C upgrade under development).

Cleans hot-bending graphite molds without damaging the graphite.

Cooling and lubrication fluid dedicated to CNC grinding of glass.

Solvent-type machine wash for cleaning production equipment.

Specialized remover for display lamination adhesive.

Wipe-cleaning reagent for equipment surfaces with a blended-solvent system.

Dedicated stripper for PVD coatings on metal parts.

Removes heavy plated coatings from umbrella hardware.

Dedicated degreaser for CNC-machined aluminum parts.

Post-fine-grinding cleaning for metal and glass parts.

Stainless steel degreasing completed in 1 minute at 10% concentration and 55°C.

Acidic co-cleaner system for fine-ground metal and glass.

Fluorine-containing acidic composite passivation for stainless steel and aluminum alloys.

Anti-static agent for sandblasting/deburring: eliminates static during blasting to prevent abrasive agglomeration for uniform finish on phone frames and metal parts.

Eco-friendly water-based cleaner that thoroughly removes flux and rosin residues.

Semi-aqueous stencil cleaner with solvency and eco-profile between solvent-based and water-based products.

Semi-aqueous, eco-friendly removal of post-soldering flux and rosin residues.

Low-residue, fast-drying cleaning after BGA rework.

High-purity molybdenum boat for vacuum evaporation and sintering carriers, T0.2×L58 mm.

Thin-profile molybdenum boat for fine coating jobs, T0.15×H15×W23 mm.

High-purity molybdenum evaporation carrier box for high-temperature loading.

Carbon tube for coating and process use — companion consumable supply.