Application experience across industries

TGV uses laser modification plus wet etch, demanding high selectivity, undercut control and glass-substrate safety; post-etch cleaning must remove residue particles and ionic metals for subsequent metallization.

Supply high-selectivity TGV glass etchants, post-etch cleaners and developing chemistries across laser-modified wet hole-forming, cleaning and patterning.

Selectivity and undercut control protect via quality, balancing etch rate with glass-substrate safety, with process calibration and localization support.

Cover glass and optical processing spans grinding, cleaning, screen printing, ink stripping and coating — demanding cleanliness, stripping efficiency, substrate safety and environmental compliance.

Supply process cleaners, screen-ink strippers, PVD/coating strippers and grinding fluids across CNC through pre-coating steps, with customization per line.

One-stop multi-process supply reduces vendor management; products pass RoHS, halogen and VOC testing for export compliance.

FOUPs accumulate particles and organics; litho and etch steps are highly sensitive to ionic residue and undercut.

Provide SP-Clear carrier cleaners, wafer process cleaners and high-selectivity etchants/developers across clean–etch–develop.

Formulas balance cleaning power with material safety; etchants benchmarked internationally as localization alternatives.

ACF/OCA rework must remove adhesive without harming ITO or polarizer; process cleaning demands low ionic residue.

Supply ACF de-gum, OCA residue remover, pre-bonding cleaner and process clean/develop chemicals using cold-soak swelling-peel.

Gentle formulas protect TAC and ITO; pre-bond and rework products address the same customer line together.