Semiconductor & Advanced Packaging Solutions
Electronic-grade chemistries covering carrier cleaning, wafer processing, TGV glass substrates and metal etching for semiconductor and advanced packaging.
Process Chain
Carrier & FOUP Cleaning
FOUP/FOSB and mask boxes accumulate particles, organics and ionic contamination during repeated use. Match neutral, mild-alkaline or high-alkaline cleaners to the carrier material and soil type.
Wafer Process Cleaning
Covers blue-film residue removal after dicing, post-CMP cleaning, dry-etch residue removal, EBR, post-plating and post-thinning cleaning, matched to residue type.
TGV Glass Substrate
One-stop for TGV glass: via etch, in-via cleaning, surface modification and seed-layer etch, compatible with laser-modified thermal-alkaline and spray/ultrasonic processes.
Metal Etch & Develop
Etchants for Ti/Mo/Ru/W interconnect metals plus RDL developer with high selectivity, low undercut and corrosion protection for fine geometries.
Not sure which to choose?
Our process engineers will recommend products and arrange samples for your line.