Display-module process cleaning formulation upgraded for better residue removal and cleanliness

Display-module processes demand stricter removal of residue, fingerprints and particles. SEMPURION upgraded multiple aqueous and semi-aqueous formulas to balance cleaning power with material compatibility across substrates and adhesives.

The upgraded formulas accelerate removal of full-lamination and OCA/OCR residue while reducing attack on films and inks, lowering residue and white spots to improve cleanliness and yield.

Across process nodes, SEMPURION offers tailored combinations from de-gumming to process cleaning, working with process teams on on-site calibration and tuning.